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COXBYTE Phase Change Silicone Pad (CPU/GPU Cooling), TPK-30 Gaming Laptop Graphics Card Core Dedicated Cooling Thermal Patch, 38*38mm

COXBYTE Phase Change Silicone Pad (CPU/GPU Cooling), TPK-30 Gaming Laptop Graphics Card Core Dedicated Cooling Thermal Patch, 38*38mm

SKU : 100119315223

Availability : In stock

4.7

Weight : 0.08 kg

Length : 15.6 cm

Height : 1.7 cm

GHS 50.05

GHS 54.06

Order now and get it less than 12-18 days

Pickup from our office at up to 0.00 delivery fee.

GHS 50.05

GHS 54.06

Order now and get it by 12-18 days

Pickup from our office at up to 0.00 delivery fee.

Product Description

**Product Specifications:**

**Brand:** COXBYTE

**Model:** ThermalSolutions TPK-30

**Description:** High-energy flagship thermal paste for CPU/GPU, featuring phase-change silicon grease film that is easy to tear and apply, durable, and safe. With a 4-6 core advantage, enhanced with submicron alumina for 10x increased density and GLASSINE release paper for improved texture and tear resistance. The 0.25mm gold thickness and new composite phase-change material provide superior performance compared to industry standards.

**Working Principle of Phase-change Material:**

1. **2nd Channel:** At room temperature, the phase-change silicon grease film remains solid. The high thermal conductivity phase-change silicon grease film contains unique phase-change materials and submicron alumina spheres. As the temperature rises, the film becomes softer, better filling gaps to dissipate heat more effectively into the heat sink, achieving better heat dissipation and maintaining device performance. Upon cooling, it solidifies again, maintaining the integrity of the polymer matrix for long-term reliability.

2. **3rd Channel:** At 50°C phase-change thermal conductivity, the material flows when the chip temperature exceeds 50°C and returns to its solid state when the temperature drops below 50°C, continuously carrying away heat during the phase-change process.

**Material Selection:**

- Organic silicon materials from a global leader in the field are used to create a new composite phase-change pad, reducing chip temperatures by 3.5°C compared to previous versions. Selected for fine and uniform texture, eliminating rough particles.

**Additional Features:**

- Precision cutting ensures the silicon grease film softens evenly when heated, providing comprehensive and precise coverage without overflowing.

- Upgraded GLASSINE release paper maintains the moisture of the silicon grease film, preventing sticking and ensuring easy separation.

- GLASSINE release paper is a type of industrial paper treated with coatings to enhance properties such as high temperature resistance, moisture resistance, and oil resistance, providing good internal strength, transparency, and durability.

**Durability and Performance:**

- Endures high temperatures up to 280°C during a 30-minute baking test, showcasing high-quality, fine materials and strong structural stability.

- Long-lasting and evaporates resistant, ensuring extended service life even under low temperatures.

**Operating Instructions:**

1. Clean the CPU surface and heat sink base with the included cleaning kit.

2. Cut the silicon grease film to fit the CPU size.

3. Peel off one side of the release paper and apply the film to the CPU surface.

4. Press the film evenly with your thumb and remove the other half of the release paper before use.

**Product Details:**

- **Product Name:** TPK-30

- **Thermal Impedance:** 0.04°C.cm²/w

- **Size:** As per options