Search for categories, brands, collection of products or a product
Quickly access Made In Africa and popular products over 180M+ products by running a simple search.
GHS
Add default address
Search for any product
Quickly access Made In Africa, popular brands and over 180M+ products by running a simple search.
Order now and get it less than 12-18 days
Pickup from our office at up to 0.00 delivery fee.
Contact Us on 0244133328 for any enquiry or assitance in placing your order
Order now and get it by 12-18 days
Pickup from our office at up to 0.00 delivery fee.
Contact Us on 0244133328 for any enquiry or assitance in placing your order
**Product Specifications:**
**Appearance Structure:**
- Connector: 81
- Label: 51
- Skirt: 7
- Dust Cap: 6
- Shell: 4
- Total: 132
**Product Details:**
01. Dual LC interface, optical module interface, high precision connection.
02. Gold finger, imported chip, low power consumption for stronger signal.
03. Plug and play connection, hot-swappable support.
**Product Parameters:**
- Module Name: Optical Module-eSFP-GE-Multimode Module (850nm, 0.55km, LC)
- Part Number: 02315204
- Model: eSFP-GE-SX-MM850
- Package: eSFP
- Interface Standard: 1000BASE-SX
- Connector Type: LC/DLC
- Fiber Type: MMF
- Operating Temperature: -20°C to +85°C
- Transmission Rate: 1 Gbit/s
- Target Transmission Distance: Multimode fiber: 0.55km
- Sending End Optical Parameters: Center Wavelength: 850nm, Max Sending Power: -2.5dBm, Min Sending Power: -9.5dBm, Min Extinction Ratio: 8P6
- Receiving End Optical Parameters: Receive Sensitivity: -17dBm, Overload Optical Power: 0dBm
**Product Specifications:**
- Independent packaging with original factory seal, module and white box with the same SN code.
- Reminder: Use optical (electric) modules certified by HUAWEI for switch equipment. Non-certified modules may lead to unstable operations.
**Certification:**
- HUAWEI certifies optical modules for switch usage, ensuring quality through comprehensive functional verification.
**Optical Module Categories and Corresponding Relationships:**
- (See detailed table for various encapsulation types, rates, and standards)
**Core Capabilities:**
- Low power consumption, stable performance, imported chips.
- Safe materials, low power consumption, precise craftsmanship.
- Gold-plated hard gold for reliable connections.
- Imported chips for high-performance, low-power module solutions.
**Additional Information:**
- HUAWEI ensures quality through rigorous testing and superior craftsmanship.
- Imported chips guarantee stable and fast signal transmission.
- Gold finger inspection, precise circuit board assembly, and metal shell components for optimal performance and aesthetics.